CPU Architect, Memory Subsystem & Interconnects - Remote

Overview

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

In Short

• Assist in the design and optimization of memory subsystems, including cache hierarchies, coherence protocols, and memory controllers.
• Contribute to the development of high-performance interconnect architectures, including on-chip networks and chip-to-chip interfaces.
• Perform simulations, modeling, and performance analysis of memory and interconnect components.
• Collaborate with hardware and software teams to optimize memory access patterns and system performance.
• Stay up to date with industry trends and emerging technologies in CPU architecture, memory, and interconnects.
• Support documentation and presentation of architectural decisions, trade-offs, and findings.

Requirements

• Bachelor’s or Master’s degree in Computer Engineering, Electrical Engineering, or Computer Science (or equivalent experience).
• Strong understanding of computer architecture fundamentals, including memory hierarchy, cache coherence, and interconnect topologies.
• Familiarity with performance modeling and simulation tools (e.g., Gem5, SimpleScalar, or similar).
• Basic knowledge of hardware description languages (e.g., Verilog, VHDL) and system-level programming (C, C++).
• Problem-solving skills and ability to analyze complex system interactions.
• Excellent communication and teamwork abilities.
• Hands-on experience with performance profiling tools and benchmarking methodologies.
• Exposure to parallel processing architectures and multi-core systems.
• Knowledge of DDR, HBM, and other emerging memory technologies.
• Experience with interconnect protocols such as AXI, PCIe, or CXL.

Benefits

• Highly competitive compensation package.
• Equal opportunity employer.
• Comprehensive benefits package.