Senior Semiconductor Packaging Engineer - Remote

Overview

This role involves pioneering next-generation semiconductor packaging solutions at Natcast's CHIPS for America R&D Flagship Facility, focusing on developing breakthrough technologies that revolutionize advanced packaging integration and performance.

In Short

• Lead groundbreaking research initiatives in advanced semiconductor packaging.
• Develop and validate advanced packaging architectures.
• Explore and evaluate novel materials for advanced packaging applications.
• Design cutting-edge packaging solutions.
• Optimize thermal management systems.
• Create and implement scalable integration processes.
• Guide the development of prototypes to test and validate solutions.
• Collaborate with cross-functional teams to drive innovation.
• Author technical publications and present research results.
• Mentor and lead research staff.

Requirements

• Ph.D. in Materials Science, Mechanical Engineering, or a related field.
• 5+ years of experience in semiconductor packaging research or development.
• Expertise in 3D integration technologies.
• Strong background in materials science.
• In-depth knowledge of thermal management techniques.
• Hands-on experience with process integration and prototyping.
• Demonstrated ability to publish research findings.
• Proven project leadership skills.
• Exceptional analytical and problem-solving skills.

Benefits

• Opportunity to work on cutting-edge technology.
• Collaborate with industry leaders and research pioneers.
• Contribute to advancing America's semiconductor capabilities.
• Engage in a mission-driven environment.
• Mentorship and leadership opportunities.