Principal ASIC Package Design Engineer - Remote

Overview

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by $450M from leading investors including Altimeter Capital, Redpoint Ventures, T. Rowe Price, Lightspeed Venture Partners, Alpine Space Ventures, and others – with an additional $500M in signed contracts across commercial and US government customers – we’re mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.

In Short

• Lead advanced ASIC package architecture and execution.
• Focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.
• Own the end-to-end package strategy for high-performance mixed-signal and digital SoCs.
• Define standards and influence silicon and system architecture.
• Drive detailed design of FC-BGA packages.
• Lead package-level trade studies across various parameters.
• Establish organizational package design standards and best practices.
• Serve as the primary technical interface to substrate vendors and assembly houses.
• Drive material selection and assembly process optimization.
• Collaborate with silicon, RF, and systems teams.

Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 10+ years of experience in ASIC package design.
• Deep expertise in FC-BGA and high-pin-count ASIC packages.
• Strong understanding of substrate technologies and thermal management.
• Fluent in SI/PI and EM simulation tools.
• Experience with OSATs and substrate vendors.
• Knowledge of packaging qualification and test methodologies.

Benefits

• Base salary range of $200,000 – $280,000 + equity.
• Comprehensive benefits package including medical/dental/vision coverage.
• Paid time off and paid parental leave.
• Many other perks.