Application Engineer - Remote

Overview

The University of Chicago, in collaboration with Fermilab, is seeking highly motivated Application Engineers to support the Advanced Chip Enablement, 3D Hub (ACE-3D), part of the NSF Chip Design Hub initiative. Application Engineers will play a central role in enabling faculty, students, and collaborators to design, prototype, and test 3D integrated circuits (3D ICs), chiplets, and advanced packaging solutions.

In Short

• Facilitates advanced technical/scientific research projects.
• Develops and maintains 3D IC design flows.
• Provides hands-on support for researchers using EDA tools.
• Automates workflows using scripting/programming.
• Collaborates with foundries for design submissions.
• Documents methodologies for the ACE-3D community.
• Trains new laboratory personnel.
• Supports cross-institutional collaborations.
• Conducts engineering studies and assigns work.
• Plans resources effectively to ensure project delivery.

Requirements

• College or university degree in related field.
• 2-5 years of work experience in a related job discipline.
• Extensive understanding of EDA tools for IC design.
• Familiarity with 3D IC design concepts.
• Strong programming skills in Python and C.
• Knowledge of Linux-based operating systems.
• Excellent communication and time management skills.
• Ability to handle multiple tasks within deadlines.
• Knowledge of research techniques and methods.
• Familiarity with local and federal regulations.

Benefits

• Wide range of benefits programs including health and retirement.
• Paid time off.