ASIC Package Engineer SI/PI Engineer - Remote

Overview

An experienced ASIC Packaging Engineer focusing on Signal Integrity and Power Integrity to support the development of custom ASICs.

In Short

• Drive chip-package-system co-design by analyzing and optimizing signal and power integrity requirements.
• Define power tree structure and netlists for High Performance Computing based on 2.5D/3D package technology.
• Run pre-layout and post-layout simulation flow for high-speed interface and PDN.
• Develop SIPI validation methodology and detailed engineering test plans.
• Validate high-speed interface and PDN impedance in lab.
• Collaborate with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams.
• Perform package/board power delivery network AC+DC simulation.
• Develop next-gen memory interface considering IO PHY, SI/PI, and physical design.

Requirements

• Genuine H1B candidates with verifiable I-94 travel history (C2C acceptable).
• Green Card & US Citizens will be considered only on W2 payment terms.

Benefits

• Confidentiality of all information according to EEO guidelines.