Senior Package Engineer - Remote

Overview

NVIDIA is seeking a passionate Senior Package Engineer to join their team in Israel, where you will collaborate with design and program teams in developing sophisticated IC substrates for groundbreaking products.

In Short

• Lead the development of microelectronics packaging for future products.
• Collaborate with leading vendors on ambitious packaging solutions.
• Thrive in a dynamic and challenging environment.
• Investigate and support production excursions and reliability issues.
• Work closely with SI, layout, and ASIC design teams.
• Plan schedules and resolve packaging and manufacturing issues.
• 10+ years of experience in engineering roles.
• Strong interpersonal and communication skills required.
• Hands-on FEA mechanical simulation experience preferred.
• Team-oriented with a focus on quality and project schedules.

Requirements

• BSc or equivalent experience in Mechanical Engineering, Materials Engineering, Physics, or similar.
• At least 5 years of experience with complex ASIC package development.
• Experience working with subcontractors and vendors.
• Curious and creative problem solver.
• Organized and able to multi-task.
• Team management experience is an advantage.
• Familiarity with manufacturing statistics tools like JMP.
• Background in semiconductor manufacturing processes.

Benefits

• Highly competitive salaries.
• Comprehensive benefits package.
• Diverse and supportive work environment.
• Opportunities for career advancement.
• Commitment to diversity and inclusion.
• Equal opportunity employer that values all applicants.